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Mô tả sản phẩm
XT V 160 high-quality PCB inspection system
The XT V 160 is specifically designed for use in production lines and failure analysis laboratories. With a precision joystick, system users control the 5-axis sample manipulator. Real-time X-ray allows them to intuitively navigate complex printed circuit boards and electronic components and quickly trace defects. In automated inspection mode, samples can be inspected at highest throughput.
Max kv | 160 kV |
---|---|
Power rating | 20 W (radiography), 10 W (CT)1 |
X-ray source | Open tube transmission target |
Focal spot size | 1 µm1 (below 2 W) rising to 10 µm depending on power |
Defect recognition capability | 500 nm |
Geometric magnification | 2.5x -2,400x |
System magnification | Up to 36,000x |
Imaging system (Standard) | 1.45 Mpixel 12-bit camera with dual field 4"/6" image intensifier |
Imaging system (Option) | Varian 1313DX (1 Mpixel, 16-bit) Flatpanel Varian 2520DX (3 Mpixel, 16-bit) Flatpanel Dexela 1512 (3 Mpixel, 14-bit) Flatpanel |
Manipulator | 5-axis (X, Y, Z, T, R) |
Rotate axis | Included |
Tilt | 0 - 75 degrees |
Measuring volume | Largest square in single map 406x406 mm (16x16") Absolute max 711x762 mm (28x30") |
Max. sample weight | 5 kg (11 lbs) |
Monitor | Single 4k IPS (3840x2160 pixels) |
Cabinet dimensions (WxDxH ) |
1200 x 1786 x 1916 mm (48.0x71.3x75.4") |
Weight | 1.935 kg (4,266 lbs) |
Radiation safety | <1μSv/hr at the cabinet surface |
Control | Inspect-X control and analysis software |
Automated inspection | Included |
Computed Tomography | Optional CT and/or X.Tract |
Primary applications | Real-time and automated electronics and semiconductor inspection, failure analysis (BGA, μBGA, flip-chip and loaded PCB boards) |
1 Measured at 80 kV, 80 µA