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Mô tả sản phẩm
XT V 130C - Cost-effective X-ray inspection of electronic components
The XT V 130C is a highly flexible and cost-effective electronics and semiconductor inspection system. The system features a 130kv/10 watt Nikon Metrology manufactured source, a globally recognised open tube design with integrated generator, and a high-resolution imaging chain.
Through a series of factory and field upgrades, the end-user can configure these systems to its own needs with a higher power source, a rotating sample tray, automatic inspection software, a digital flat panel option, and the ability to add future-proof CT technology.
Max kV | 130 kV |
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Max. electron beam power | 10 W |
X-ray source | Open tube transmission target |
Focal spot size | 3 µm1 (below 2 W) 1; rising to 10 µm at 10W |
Defect recognition capability | 2 µm |
Geometric magnification | 2.5x-2,400x |
System magnification | Up to 36,000x |
Imaging system (Standard) | 1.45 Mpixel 12-bit camera with 6" image intensifier |
Imaging system (Option) | 1.45 Mpixel 12bit camera with dual field 4”/6” image intensifier Varian 1313DX (1 Mpixel, 16-bit) Flatpanel Varian 2520DX (3 Mpixel, 16-bit) Flatpanel Dexela 1512 (3 Mpixel, 14-bit) Flatpanel |
Manipulator | 4-axis (X, Y, Z, T) |
Rotate axis | Optional |
Tilt | 0 - 75 degrees |
Measuring volume | Largest square in single map 406x406 mm Absolute max 711x762 mm |
Max. sample weight | 5 kg (11 lbs) |
Monitor | Single 4k IPS (3840x2160 pixels) |
Cabinet dimensions (WxDxH) | 1200 x 1786 x 1916 mm |
Weight | 1,935 kg (4,266 lbs) |
Radiation safety | |
Control | Inspect-X control and analysis software |
Automation inspection | Optional |
Computed Tomography | Optional CT and/or X.Tract |
Applications | Real-time inspection of electronics (BGA, µBGA, flip-chip and loaded PCB boards) |