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Danh mục:
SakiTừ khóa:
Vận chuyển giao hàng toàn quốc
Phương thức thanh toán linh hoạt
Gọi ngay 0974692294 để mua và đặt hàng nhanh chóng
Mô tả sản phẩm
The newly developed high-resolution camera system ensures a sharply focused image and provides enhanced inspection resolution for tiny components such 0402mm or 0201mm SMD chips, fine-pitch ICs and closely located pads.
Despite its high resolution, the height-measurement range extends up to 25mm, enabling 3D inspection of all types of SMT-mounted parts including extremely small and tall components. |
Tall component in SMT process |
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Combined with the Z-axis option, the height measurement range can be expanded up to 40mm. |
Z-axis Option |
Saki's team of optical-inspection experts handles all software development in-house. This ensures optimal interactions and coordination with the various hardware subsystems, achieving the industry's fastest cycle time. Image capture, processing and inspection algorithms are executed in parallel, minimizing waiting times.
*Total time of capturing and inspection with Saki's sample board in A5 size (150mm x 214mm).
*The inspection time may vary depending on the inspection condition.
Saki's unique soldering inspection algorithm improves pass/fail inspection accuracy by assessing both soldering fillet shape and wetting height. |
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High-resolution images from the new camera system and enhanced color visibility of solder surface thanks to the advanced dome lighting* greatly enhance support for operator judgement. |
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Saki's new 3D AOI series delivers greater flexibility with the option to upgrade the camera system and customize the optical resolution and lighting according to specific production needs or the manufacturing environment. Customers can apply both hardware and software upgrades themselves to improve machine inspection capabilities, with minimal expertise needed and without significant downtime.
Dimensions | M Single Lane |
M Dual Lane |
L Single Lane |
L Dual Lane |
XL Single Lane |
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Model | 3Di-MS3 | 3Di-MD3 | 3Di-LS3 | 3Di-LD3 | 3Di-ZS3 | |
Size (W) x (D) x (H) [Main body]mm (in.) |
850×1430×1500 (33.46 x 56.30 x 59.06) |
1040×1440×1500 (40.94 x 56.69 x 59.06) |
1340×1440×1500 (52.75 x 56.69 x 59.06) |
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Weight | Approx. 850 Kg, 1873.93 lbs | Approx. 900 Kg, 1984.16 lbs | ||||
Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz | |||||
Resolution | 8μm | |||||
Air Requirement | 0.5MPa, 5L/min(ANR) | |||||
PCB Size mm (in.) |
- | Single mode | - | Single mode | - | |
50 W x 60 L - 330 W x 330 L (1.97 W x 2.36L - 12.99 W x 12.99 L) |
50 W x 60 L - 330 W x 330 L (1.97 W x 2.36L - 12.99 W x 12.99 L) |
50 W x 60 L - 500 W x 510 L (1.97 W x 2.36 L - 19.68 W x 20.07 L) |
50 W x 60 L - 500 W x 510 L (1.97 W x 2.36 L - 19.68 W x 20.07 L) |
50 W x 60 L - 686 W x 870 L (1.97 W x 2.36 L - 27.00 W x 34.25 L) |
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Dual mode | Dual mode | |||||
50 W x 60 L - 320 W x 330 L (1.97 W x 2.36L - 12.60 W x 12.99 L) |
50 W x 60 L - 320 W x 510 L (1.97 W x 2.36 L - 12.60 W x 20.07 L) |
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PCB Clearance | Top: 40mm, 1.57 in. Bottom: 60mm, 2.36 in. |
Top: 40mm, 1.57 in. Bottom: 50mm, 1.96 in. |
Top: 40mm, 1.57 in. Bottom: 60mm, 2.36 in. |
Top: 40mm, 1.57 in. Bottom: 50mm, 1.96 in. |
Top: 40mm, 1.57 in. Bottom: 60mm, 2.36 in. |