MC302 Benchtop Reflow Oven

Designed for labs, small-scale production, prototyping, schools and manufacturability testing.

The MC302 Benchtop Convection Reflow Oven features a full hot air convection system, ensuring even heating of components and PCBs while eliminating shadow effects and preserving color sensitivity during the soldering process. Equipped with a Dynamic Thermal Profile system, it dynamically adjusts heat control and fan speed based on real-time temperature feedback from the product, delivering exceptional thermal accuracy.

Designed for product development, prototyping, schools, and small-scale production, the MC302 makes it easy to set up and store solder profiles via an intuitive app. This advanced level of control, typically found in larger and more expensive reflow ovens, offers a professional-grade reflow process in a compact and cost-effective package.