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Danh mục:
UnicompTừ khóa:
Vận chuyển giao hàng toàn quốc
Phương thức thanh toán linh hoạt
Gọi ngay 0974692294 để mua và đặt hàng nhanh chóng
Mô tả sản phẩm
| Place of Origin: | China | 
|---|---|
| Brand Name: | UNICOMP | 
| Certification: | CE, FDA | 
| Model Number: | AX8300 | 
Payment & Shipping Terms:
| Minimum Order Quantity: | 1Set | 
|---|---|
| Price: | can negotiate | 
| Packaging Details: | Wooden Case, Waterproof, Anti-collision | 
| Delivery Time: | 30 days | 
| Payment Terms: | T/T, L/C | 
| Supply Ability: | 300 sets per month | 
Detailed Product Description
| Name: | X-ray Inspection Machine | Application: | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor | 
|---|---|---|---|
| Tube Voltage: | 100KV/110KV | X-ray Leakage: | < 1uSv/h | 
| Weight: | 1500kg | Power Consumption: | 1.5KW | 
| High Light: | 
			x ray detection equipmentx ray inspection equipmentUnicomp X Ray Detector | 
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SMD Cable Electronics Components Unicomp X-ray Detector AX8300
The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much.
Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme high magnification/resolution images that are similar to the highest resolution 90kV x-ray tubes can produce. Additionally, the AX-8300 offers 360 degree table rotation providing unlimited image views.
Features:
110kV Microfocus x-ray source,
High resolution FPD
X/Y/Z/Tilt Motions (table, tube, FPD)
360° Table Rotation
Angle View up to 70 Degrees
Point and Click Location Navigation
CNC Programming for Multiple Image Inspection Routines
Max Inspection Area 360 x 340mm
Application:
1. BGA/CSP/FLIPS CHIP: Bridging ,Voids,Opens,Expcessive/insufficient
2. QFN: Bridging,Voids,Opens,Registration
3. SMT Standard components: QFP,SOT,SOIC,Chips,Connectors,Others
4. Semiconductor: bond wire,die attach VOID ,MOLD,VOID
5. Multi-layer board(MLB): Inner layer registration,PAD stack,blind/buried vias
| 
			 Model  | 
			
			 AX8300  | 
		
| 
			 Max kV/type  | 
			
			 110 kV(Option90 kV)/Sealed  | 
		
| 
			 Max.Electron beam power  | 
			
			 25W(Option8W)  | 
		
| 
			 Focal spot size1  | 
			
			 7μm  | 
		
| 
			 System magnification  | 
			
			 Up to 1000X  | 
		
| 
			 Imaging system(Option)  | 
			
			 Flat Panel Detector  | 
		
| 
			 Manipulator  | 
			
			 8-axis with tilt 50 degree  | 
		
| 
			 Measuring volume  | 
			
			 Max load area 300x300mm2  | 
		
| 
			 Max.sample weight  | 
			
			 5kg  | 
		
| 
			 Monitors  | 
			
			 22" LCD  | 
		
| 
			 Cabinet dimensions  | 
			
			 1100x1100x1650mm  | 
		
| 
			 Weight  | 
			
			 1700kg  | 
		
| 
			 Radiation safety2  | 
			
			 <1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm  | 
		
| 
			 Control  | 
			
			 Keyboard/Mouse/Joystick  | 
		
| 
			 Automated inspection  | 
			
			 Standard  | 
		
| 
			 Primary applications  | 
			
			 Chip inspection/Electronic components/Auto parts.etc  | 
		
| 
			 1.Focal spot size is a variable.Please consult the unicomp 2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission.  | 
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Inspection Images:
