AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC

Danh mục:

Unicomp

Từ khóa:

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Gọi ngay 0974692294 để mua và đặt hàng nhanh chóng

Mô tả sản phẩm

Place of Origin:	China
Brand Name:	UNICOMP
Certification:	CE, FDA
Model Number:	AX7900

Payment & Shipping Terms:

Minimum Order Quantity:	1Set
Price:	can negotiate
Packaging Details:	Wooden Case, Waterproof, Anti-collision
Delivery Time:	30 days
Payment Terms:	T/T, L/C
Supply Ability:	300 sets per month

Detailed Product Description

Name:	Unicomp X-ray Inspection Machine	Application:	SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage:	80KV/90KV	Industry:	Electronics Industry
Size:	1100(L)x1100(W)x1500(H)mm	X-ray Leakage:	< 1uSv/h
Weight:	1000kg	Power Consumption:	0.8KW
High Light:	BGA QFN Unicomp X Ray machine IC Inspection Unicomp X Ray machine DXI image X ray Inspection Machine

5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection

Description of IC Xray machine AX7900:
90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.

FEATURES of IC Xray machine AX7900:

90KV 5μm X-ray tube, FPD Detector.
Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
Multi-function DXI image processing system.
X/Y programming function for multiple image inspection routines
Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
BGA void/area auto-measurement plus report generation.

APPLICATION of IC Xray machine AX7900:

LED, SMT, BGA, CSP, Flip Chip Inspection.
Semiconductor, Packaging components, Battery Industry.
Electronic components, Auto parts, Photovoltaic Industry.
Aluminum Die Casting, Moulding Plastic.
Ceramics, Other Special Industries

Technical Specifications

Item	Definition	Specs
System Parameters	Size	1100(L)x1100(W)x1500(H)mm
	Weight	1000kg
	Power	220AC/50Hz
	Power Consumption	0.8kW
X-ray Tube	Type	Closed
	Max.Voltage	80kV/90kV
	Max.Power	12W/8W
	Spot Size	5μm/15μm
X-ray System	Intensifier	FPD
	Monitor	22 ‘’LCD
	System Magnification	160 X/360X
Detection Region	Max.Loading Size	440mm x 400mm
Detection Region	Max.Inspection Area	420mm x 380mm
X-ray Leakage		<1μSv/h