China Unicomp AX8200 BGA/IC/PCB Closed X-Ray Machine with factory price

China Unicomp AX8200 BGA/IC/PCB Closed X-Ray Machine with factory price

Danh mục:

Unicomp

Từ khóa:

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Gọi ngay 0974692294 để mua và đặt hàng nhanh chóng

Mô tả sản phẩm

Place of Origin:	China
Brand Name:	Unicomp
Certification:	CE/FDA
Model Number:	AX8200

Payment & Shipping Terms:

Minimum Order Quantity:	1 set
Price:	USD40000-50000
Packaging Details:	Vacuum Wooden Package
Delivery Time:	20 days
Payment Terms:	T/T
Supply Ability:	50 sets per month

Detailed Product Description

Video Outgoing-inspection:	Provided	Marketing Type:	New Product
Core Components:	Contact Us	After-sales Service:	Online Support,Engineers Available To Service Machinery Overseas
Feature:	Non Destructive Testing	Tube Voltage:	100 Kv
Focu Size:	5μm	X-Ray Leakage:	≤1 U Sv/h
Detector:	FPD	Warranty:	1 Year
Tube Type:	Closed	Test Report:	Provided
High Light:	BGA X Ray Closed Machine DXI X Ray Closed Machine 100KV Connector Module Inspection Machine

Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200

The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)

Features:

● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera.

● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement.

● Multi-function DXI image processing system

● X/Y programming function for multiple image inspection routines

● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification.

BGA void/area auto-measurement plus report generation.

Applications:

BGA , CSP , LED , Flip Chip , Semiconductor,

Battery Industry , Small Metal Casting,

Electronic Connector Module,

Aerospace Components , Photovoltaic Industry,

Other Special Industries.

Item	Definition	Specs
System Parameters	Size	1080(L)X1180(W)X1730(H)mm
	Weight	1150kg
	Power	220AC/50HZ
	Power Consumption	0.8KW
X-Ray Tube	Type	Closed
	Max.Voltage	90kv/100kv
	Max.Power	8W
	Spot Size	5μm
X-Ray System	Intensifier	4"Image Intensifier
	Monitor	22"LCD
	System Magnification	600X
Detection Region	Max.Loading Size	510mm x 420mm
Detection Region	Max.Inspection Area	435mm x 385mm
X-Ray Leakage		<1μSv/h