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Danh mục:
UnicompTừ khóa:
Vận chuyển giao hàng toàn quốc
Phương thức thanh toán linh hoạt
Gọi ngay 0974692294 để mua và đặt hàng nhanh chóng
Mô tả sản phẩm
Place of Origin: | China |
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Brand Name: | UNICOMP |
Certification: | CE, FDA |
Model Number: | AX7900 |
Payment & Shipping Terms:
Minimum Order Quantity: | 1Set |
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Price: | can negotiate |
Packaging Details: | Wooden Case, Waterproof, Anti-collision |
Delivery Time: | 30 days |
Payment Terms: | T/T, L/C |
Supply Ability: | 300 sets per month |
Detailed Product Description
Name: | Unicomp X-ray Inspection Machine | Application: | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor |
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Tube Voltage: | 80KV/90KV | Industry: | Electronics Industry |
Size: | 1100(L)x1100(W)x1500(H)mm | X-ray Leakage: | < 1uSv/h |
Weight: | 1000kg | Power Consumption: | 0.8KW |
High Light: |
Semicon IC Unicomp X ray machineIC Components Unicomp X ray machine5 um Unicomp X Ray Machine |
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing
Description of AX7900:
90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.
FEATURES of AX7900:
90KV 5μm X-ray tube, FPD Detector.
Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
Multi-function DXI image processing system.
X/Y programming function for multiple image inspection routines
Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
BGA void/area auto-measurement plus report generation.
APPLICATION of AX7900:
LED, SMT, BGA, CSP, Flip Chip Inspection.
Semiconductor, Packaging components, Battery Industry.
Electronic components, Auto parts, Photovoltaic Industry.
Aluminum Die Casting, Moulding Plastic.
Ceramics, Other Special Industries
Item | Definition | Specs |
System Parameters | Size | 1100(L)x1100(W)x1500(H)mm |
Weight | 1000kg | |
Power | 220AC/50Hz | |
Power Consumption | 0.8kW | |
X-ray Tube | Type | Closed |
Max.Voltage | 80kV/90kV | |
Max.Power | 12W/8W | |
Spot Size | 5μm/15μm | |
X-ray System | Intensifier | FPD |
Monitor | 22 ‘’LCD | |
System Magnification | 160 X/360X | |
Detection Region | Max.Loading Size | 440mm x 400mm |
Max.Inspection Area | 420mm x 380mm | |
X-ray Leakage | <1μSv/h |
Inspection Images of AX7900: